Digitale Möglichkeiten des indirekten Bondings

This article describes two options for the digital planning and fabrication of indirect transfer splints. The digital development in orthodontics today enables new ways of working, especially in the field of indirect bonding. A distinction can be made between the semidigital method, which combines digital bracket planning with the conventional thermoforming method, and the fully digital method, in which the transfer splints are 3D printed. Both methods have advantages and disadvantages in terms of bracket transfer accuracy. However, a clear workflow is crucial in order to optimize the benefits of these technologies. Continuous development and customization based on individual patient needs and the latest findings in the scientific literature are necessary to further develop these promising possibilities. Keywords: 3D printing, digital workflow, digital orthodontics, indirect bonding, IDB